Qualcomm, TDK form $3 billion JV to make components used in wireless tech

January 13, 2016 9:35 AM

34 0

Qualcomm, TDK form $3 billion JV to make components used in wireless tech

Chipmaker Qualcomm Inc (QCOM.O) and Japan's TDK Corp (6762.T) said they have formed a $3 billion joint venture to supply key components and modules used to communicate wirelessly with devices like smartphones, drones, robots and Internet of things.

Qualcomm Global Trading Pte Ltd will hold 51 percent of the new venture RF360 Holdings, while the remaining 49 percent will be owned by EPCOS AG, a subsidiary of TDK, the companies said on Wednesday.

Also read: REFILE-UPDATE 1-Baker Hughes to form fracturing JV with Goldman Sachs, CSL Capital

Read more

To category page

Loading...