3D ‘Pop-up’ silicon structures: New process transforms planar materials into 3D microarchitectures

January 8, 2015 7:55 PM

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In the cover feature article of the journal, Science, researchers at the University of Illinois at Urbana-Champaign describe a unique process for geometrically transforming two dimensional (2D) micro/nanostructures into extended 3D layouts by exploiting mechanics principles similar to those found in children’s ‘pop-up’ books.

3D microstructures of device-grade silicon formed using concepts similar to those in children’s ‘pop-up’ books. The images correspond to colorized scanning electron micrographs. The silicon has a thickness of 2 microns.

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