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Dissected new iPhones reveal Micron, Toshiba parts

September 21, 2018 3:05 PM
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(Reuters) - Apple Inc’s (AAPL.O) latest iPhones use components made by Micron Technology (MU.O) and Toshiba (6502.T) among others, according to a firm that cracked open iPhone XS and XS Max.

Among the first detailed teardowns of the phones since their launch on September, the study by repair firm iFixit did not list any parts from Samsung and, as expected, no chips from Qualcomm Inc (QCOM.O).

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